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Engineer, HIG HBM, Product Engineering (Media Health Reliability)

SG
FULL TIME

Job Description

Req. ID:

JR102675 Engineer, HIG HBM, Product Engineering (Media Health Reliability)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities:

  • Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
  • Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.
  • DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time
  • Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
  • Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.
  • Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.
  • Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.
  • Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
  • Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
  • Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
  • Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

  • Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
  • Experience in semiconductor devices, circuit design, or product validation is a plus.
  • Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.
  • Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
  • Strong attention to detail and a commitment to quality.
  • Ability to work effectively in team-based projects, contributing to shared goals and outcomes.
  • Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.
  • Responsible and accountable, with a professional work ethic and ownership of assigned tasks.
  • Clear and effective communication skills, especially when articulating technical concepts and findings

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Job Profile(s):

Product Development Engineer 1

Relocation level: (TBD)

Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

  • Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
  • If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

About Micron

First seen: June 10, 2026
Last updated: June 15, 2026