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Job Description

Job Responsibilities:

  • 2.5D/3DIC platform development.
  • New unit module development and devices development.
  • New process verification and qualification.
  • New platform DSM setup
  • Customer engagement and new product verification

Capability

  • Solid semiconductor process integration and device characterization skills
  • Semiconductor device physics and analysis skill.
  • Experienced in 2.5D and 3DIC process development are plus.
  • Skill on FMEA, control plan, DOE (design of experiment) and problem solving.
  • Good communication, self-motived and avid learner

Qualification

  • At least bachelor degree in microelectronics/electronics/electrical/physics/Materials engineering or other relevant fields.
  • At least 3 years working experience in semiconductor R&D or related foundry experience of integration/process/device engineer.
  • Working experience: 2.5D and 3DIC integration and device background are plus.
  • Proficient English oral and writing skill.

About UNITED MICROELECTRONICS CORPORATION (Singapore Branch)

First seen: June 23, 2026
Last updated: July 23, 2026