Micro Assembly Assistant Engineer (3 months - renewable) #JTL

• Assist the Micro Assembly Engineer in die attach and wirebonding for prototype and production products.

• Operate microelectronics assembly equipment, including die attach and wirebonding machines, in accordance with approved procedures and work instructions.

• Perform operation and routine maintenance of assembly equipment and tooling.

• Handle and assemble RF ICs, capacitors, inductors, substrates, and other microelectronic components using proper ESD controls and handling procedures.

• Support prototype, first article, and pre-production builds by performing assembly and inspection tasks.

• Conduct visual inspection of assembled products using microscopes and other inspection equipment to ensure compliance with workmanship standards.

• Assist in rework and repair activities as required to meet product quality requirements.

• Accurately record production and assembly data, ensuring traceability and compliance with quality system requirements.

Requirements

• Minimum NITEC/ Diploma/ Degree in Electrical & Electronics Engineering

• Preferably with experiences in die attach and wire bonding

Interested candidates please send in your resume to: Topaz Liang Huimin (CEI No. R1104500), email to: [email protected] EA License No: 99C4599