EDE-SG Equipment Development Engineer/ Senior Engineer (Dry Etch)

Responsibilities

• Set up equipment and/or CIP hardware for evaluation by the process development team. This enables early introduction (EFMEA), maturity (EMI), and adoption of both current and next-generation 3D NAND nodes.

• Work with the Fab layout and facility team to ensure flawless installation and operation of the equipment.

• Work together with the process development team to measure the benefits of equipment/CIP hardware.

• Develop and optimize existing equipment hardware to meet the efficiency requirements of advanced 3D NAND parts.

• Engage with equipment development peers on technology choices for upcoming nodes and translate future technology needs into clear equipment requirements.

• Identify exciting equipment early and work with manufacturing to determine viable evaluation paths forward.

• Build and implement advanced equipment monitoring and control methodologies.

• Lead teams or suppliers on complex projects in focused meetings to mature equipment technology in record times for technical advantage, cost, and efficiency.

• Serve as a technical expert within Micron, providing advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents and technical papers.

• Identify and resolve safety hazards; follow strict safety procedures including lockout, chemical safety, lifting techniques, and ergonomically accurate methods.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Requirements:

• PhD, Master's Degree or Bachelor's Degree in Mechanical Engineering, Chemical Engineering, Electrical/Electronic Engineering, Materials Science or a related field.

• A minimum of 3 years of relevant experience in semiconductor equipment development

• In-depth understanding of dry etch equipment operation, working principles, troubleshooting, and tool installation procedures

• Exposure to R&D dry etch equipment transfer and the ability to develop/optimize equipment hardware design is preferred

• Exposure to Dry Etch pump/abatement/chiller selection and ability to develop/optimize equipment hardware design is preferred

• Maintain and publish roadmaps to define work/CIP’s required to move toolsets from one EMI level to the next in preparation for transfer to HVM.

• Remarkable oral and written communication skills, demonstrating the ability to express messages clearly and effectively on a local and global scale.

• Proven ability to prioritize and manage multiple projects simultaneously, efficiently applying available resources or seeking peers’ and/or management help to drive solutions.