R&D Engineer – C/A (Chip Attach) & TCB (Thermal Compression Bonding)

• To lead the development, evaluation, and optimization of advanced Thermal Compression (TC) bonding and chip attach processes and equipment for next-generation advanced packaging technologies (e.g., chiplet integration, HBM, 2.5D/3D architectures).

• To establish robust bonding recipes, ensure precise co-planarity and alignment control, and successfully drive TC bonder tools from R&D concept validation to customer/internal qualification.

• Advanced TC Bonding Process development for CoWoS PKG product family and CPO

• Tool & Hardware Development / Qualification

• Warpage & Co-planarity Control

• Failure Analysis & Reliability Enhancement

• Customer Development & Technology Transfer

• Lead assigned projects

• Yield Improvement & Yield Failure Analysis (FA)

Required Experience and Qualifications:

• Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)

• R&D or mass production experience of at least three years in Thermal Compression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes

• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements

• Fundamental understanding of advanced semiconductor packaging processes, thermal-mechanical bonding behavior, and warpage control

• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting

• Ability to prepare technical documents and deliver presentations to internal and external stakeholders

• Proficiency in reading and writing technical documents in English

• Salary up to $6000

• Location: Yishun

• Mon To Fri 8am -518pm

JOB ID: GTJK009 All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits. Kindly email your resume in a detailed Word format to [email protected] We regret that only shortlisted candidates will be notified

People Profilers Pte Ltd

• 20 Cecil Street, #08-09, Plus Building, Singapore 049705

• Tel: 69509745

• EA Licence Number: 02C4944

• EA Registration Number: R1108448

• EA Personnel: Tan Lili Gesse