Semicon R&D Engineer (Thermal Compression Bonding)

Purposeof the Job: •          To lead the development, evaluation, and optimization of advanced ThermalCompression (TC) bonding and chip attach processes and equipment fornext-generation advanced packaging technologies (e.g., chiplet integration,HBM, 2.5D/3D architectures). •          To establish robust bonding recipes, ensure precise co-planarity and alignmentcontrol, and successfully drive TC bonder tools from R&D concept validationto customer/internal qualification. Job: •          Advanced TC Bonding Process development for CoWoS PKG product family and CPO •          Tool & Hardware Development / Qualification •          Warpage & Co-planarity Control •          Failure Analysis & Reliability Enhancement •          Customer Development & Technology Transfer •          Lead assigned projects •          Yield Improvement & Yield Failure Analysis (FA) Requirement: •          Bachelor’s degree or higher in engineering or science (e.g., Material Science,Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.) •          R&D or mass production experience of at least three years in ThermalCompression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes •          Proven experience in driving customer development programs (e.g., JDP, customerqualification, technical evaluations) and managing customer requirements •          Fundamental understanding of advanced semiconductor packaging processes,thermal-mechanical bonding behavior, and warpage control •          Strong skills in experimental design (DoE), failure analysis (FA), andtechnical data reporting •          Ability to prepare technical documents and deliver presentations to internaland external stakeholders •          Proficiency in reading and writing technical documents AllSuccessful candidates can expect a very competitive remuneration package and acomprehensive range of benefits. Pleaseemail your resume in a detailed MS Word format to [email protected] stating 1)Current Drawn 2)Expecting Salary 3)Date Available 4)Reason to Leave each job: Weregret that only shortlisted candidates will be notified JoyceKoh Ai Leng PeopleProfilers Pte Ltd 20Cecil St, #08-09, PLUS Building, Singapore 049705 Tel:6950 9737 www.peopleprofilers.com EALicense Number: 02C4944 EAPersonnel Reg nos R1110618 JobID: JOB-00951