CPU Architecture Engineer - Singapore

The Server Silicon Design and Application Team drives cutting-edge innovation by designing, developing, and producing CPUs for data center servers. With a combination of engineers, researchers, and specialists, the team focuses on creating chips that are high-performance, energy-efficient, and highly reliable, powering a wide range of electronic devices and systems.

Responsibilities:

• Based on product requirements, participate in SoC system architecture design and build SoC analysis and evaluation frameworks;
• Design and optimize SoC chip architecture according to system performance, power, and cost requirements; responsible for IP selection, as well as the formulation and design of RAS, DFX, subsystem, and low-power solutions;
• Analyze system performance bottlenecks for typical application scenarios and benchmarks, and propose improvement solutions;
• Collaborate with chip design and verification teams to conduct SoC performance testing and optimization;
• Drive key technology breakthroughs; work with upstream and downstream teams on solution research, feasibility studies, and exploration of algorithms and hardware architectures;
• Continuously track industry technology trends and identify valuable core technology points and technical directions;
• Participate in system-level STCO (System Technology Co-Optimization), planning chip solutions and technology roadmaps from packaging and system-level perspectives.

Qualifications Minimum Qualification(s):

• Bachelor's degree or above in Microelectronics, Integrated Circuits, Electronic Engineering, or a related field; Master's or PhD preferred;
• 5+ years of SoC R&D experience;
• Familiar with CPU architecture, with in-depth knowledge of OS, system software, and chip architecture and design;
• Forward-thinking mindset with the ability to drive product innovation;
• Capable of independently conducting chip PPA (Power, Performance, Area) analysis;
• Experience in server SoC architecture;
• Knowledge of advanced process nodes and advanced packaging technologies (2.5D, 3D, CoWoS, EMIB), as well as system-level packaging (wafer-scale, SOIC).