Lead Research Engineer I, Adv Pkg, IME

• Process integration development for high density multi-chip fan-out wafer level packaging for various applications such as AI/ HPC, Co-package Optics, Power devices etc.

• Drive the development of new capabilities such as fine pitch RDL, micro bumping, multi-layer RDL, polymer damascene etc required for future FOWLP integration.

• Establish novel RDL-first and mold-first fan-out packaging integration flows to meet industry partners requirements for various applications.

• Plan short loops and work with process module team to develop various processes and materials evaluation for FOWLP.

• Work with industry partners and multidisciplinary team members to execute the projects/assigned tasks by resolving issues.

• Conduct engineering experiments for process characterization to drive quality and yield improvements.

• Coordinate and support engineering build using developed packaging processes and integration.

• Lead industry and internal capability development projects with manageable risks and mentor less experienced colleagues.

• Inspire and mentor young talent in semiconductor technology, contributing to workforce development in the field.

• Publish new findings and technological advancement in prestigious journals and overseas/local conferences.

Job Requirements:

• Bachelors/Masters in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or any engineering or science related field.

• 5 to 10 years of experience in any semiconductor devices fabrication process integration, and experience in wafer level bumping, RDL and fan-out wafer level package integration will be added advantage.

• Hands-on experience in semiconductor manufacturing processes such as lithography, plating, etching as well as RDL and bumping process integration.

• Knowledge of wafer level fabrication processes and advanced packaging technologies, methodologies, and reliability characterization is preferable, but not mandatory.

• Strong analytical and problem-solving skills.  Proficiency in data analysis and interpretation and design of experiments.

• Excellent written and verbal communication abilities.

• Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.

• Demonstrated expertise in heterogeneous integration, FOWLP technologies, and advanced packaging processes.