Senior Research Engineer II, fan-in/fan-out wafer-level pkg, 2.5D interposers, Adv Pkg, IME

• Plan, coordinate, and execute prototype and small-volume manufacturing runs using advanced packaging technologies, including Fan-In/Fan-Out Wafer Level Packaging (FOWLP), 2.5D interposers, and W2W/C2W 3D integration.

• Develop manufacturing plans, process flows, and work instructions to meet customer and project requirements

• Monitor production activities, troubleshoot process issues, and implement corrective actions to improve yield, quality, and cycle time.

• Work closely with process, equipment, and quality engineers to ensure stable and repeatable manufacturing performance.

• Coordinate wafer and material logistics, production scheduling, and resource allocation to ensure on-time delivery.

• Perform process monitoring, yield analysis, failure analysis, and root-cause investigations.

• Support customer prototype builds, engineering lots, and qualification activities.

• Drive continuous improvement initiatives to enhance manufacturing efficiency, quality, and operational excellence.

• Maintain manufacturing documentation, including process specifications, manufacturing reports, and quality records.

• Ensure compliance with safety, quality, and operational procedures.

Job Requirements:

• Bachelor's, Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Microelectronics, or a related discipline.

• At least 3 years of experience in semiconductor manufacturing, advanced packaging, process integration, or related fields.

• Fresh graduates with a strong interest in semiconductor packaging and manufacturing are also encouraged to apply.

• Knowledge of semiconductor packaging processes such as lithography, plating, RDL formation, wafer thinning, bonding, molding, and assembly is advantageous.

• Hands-on experience in prototype builds or low-volume manufacturing environments.

• Knowledge in 2.5D/3D IC integration, hybrid bonding, chiplet packaging, or heterogeneous integration technologies; is an advantage

• Experience with manufacturing execution systems (MES), quality management systems, and process qualification methodologies

• Familiarity with statistical process control (SPC), yield analysis, and problem-solving methodologies.

• Strong analytical, troubleshooting, and data analysis skills.

• Ability to work effectively in a multidisciplinary team environment and interact with internal and external stakeholders.

• Excellent communication and project coordination skills.