Engineer, Process (Die Prep)

Position Summary The Process Engineer (Die Prep) is responsible for development and establishment of production process.

Responsibilities

• Establish, review and update specifications, workflow, quality and safety related documentation for Die Prep (Backgrind, Dicing, Laser Grooving, etc) processes within production line.

• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.

• Process sustaining and control through SPC and periodic defect Pareto Analysis.

• Lead and drive SPC control

• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.

• Handle and manage customer audits and 8D reports.

• Provide disposition for engineering and production lots.

• Conduct process characterization and qualification to establish process baseline.

• Coordinate and liaise with vendor/suppliers on process issue or quality issue.

• Support customer NPI activities and internal engineering activities.

• New material, process & machine development and qualification.

• Review and accept machine buyoff, setup pilot line process and transfer from pilot to production line

Requirements

• Minimum Degree in Electrical & Electronics, Microelectronics, Mechanical engineering or relevant engineering discipline

• Experience in Semiconductor manufacturing industry and working in cleanroom environment

• Minimum 3 years hands-on Die Prep process such as Backgrind, Dicing, Laser Grooving within semiconductor / electronics manufacturing industry

• Experience in SPC, DOE, FEMA, and 8D reports