Associate Engineer, Equipment (Die Prep/Recon)

Position Summary

The Equipment Associate Engineer (DP/ Recon) is responsible for performing maintenance and repairs on the assigned equipment. The ideal candidate is a good team player, able to work independently, attentive to details and safety, and willing to embrace new task or responsibilities in a dynamic environment.  

Responsibilities

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.  

• Sustain and improve overall equipment performance (OEE).  

• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.  

• Participate and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.  

• Assist Engineers in setting up new machine and buy-off.  

• Maintain good housekeeping and safety practices in the cleanroom.  

• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.  

• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.  

• Comply safety standards and procedures during shift duty or working in the production line.  

• Responsible for maintenance and repairs on the assigned equipment.  

• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance.  

• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.   

• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.  

• Any other ad-hoc duties as assigned.  

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.  

• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. 

• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. 

• Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection).  

• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.